LRBU05MC11T [TAIYO YUDEN]
Data Line Filter, 3 Function(s), 50V, 0.5A;
| 型号： | LRBU05MC11T |
| 厂家： | 
TAIYO YUDEN (U.S.A.), INC |
| 描述： | Data Line Filter, 3 Function(s), 50V, 0.5A |
| 文件： | 总8页 (文件大小：840K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
コモンモードチョークコイル
（DC、信号ライン用）SMDタイプ
COMMON MODE CHOKE COILS
(FOR DC AND SIGNAL LINES)
SMD TYPE
K25VJ105C（製品自己発熱を含む）
fIncluding self-generated heatg
OPERATING TEMP.
等価回路
Equivalent circuits
特長ꢀFEATURES
YSMT対応
YAvailable in embossed tape and reel.
YHighly coupled coil construction ideal for common mode noise attenuation
Y高結合なコイル構造によりコモンモードノイズの除去に最適
用途ꢀAPPLICATIONS
YImmunity against undesirable external line radiation fields and broadcast
Y多機能電話機,PBX、FAXなど外線の不要
幅射電界および放送波に対するイ
waves generated by multifunction telephone sets, PBXs, and facsimile ma-
chines.
YPreventive measure against DC line noise in electronic equipment.
YSuppresses radiated emissions from secondary power supplies and signal
lines on AC adapters, battery chargers, and digital equipment.
YExcellent for reducing radiated noise in DVC (digital video cameras) and
DSC (digital still cameras)
YOffers high speed differential mode noise attenuation in USB and IEEE1394
connectors in personal computers, printers, scanners and other computer
peripherals
ミュニティ対策
Y各種電子機器のDCラインのノイズ対策
YACアダプタ、バッテリーチャージャー及び各種デジタル機器の電源
2 次側
ライン、信号ラインの不要
幅射対策
YDVC,DSC等の電源
、2次側 DCラインの不要輻射対策。
Yパーソナルコンピューター、プリンター、スキャナー等のUSB(DJ,DK)及
びIEEE1394の高速差動伝送のノイズ除去。
形名表記法ꢀORDERING CODE
1
3
4
5
包装記号
T
試作番号
形式
CM
BU
形状
RC
MC
01 ～ 10
テーピング品
コモンモードチョークコイル
面
実装タイプ
2
6
コアの長辺寸法 fmmg
当社管理番号
04
05
ꢀꢀ
3.5
5.0
Q
標準品
QWスペース
Z
C M 0 4 R C 0 1 T
1
2
3
4
5
6
1
3
4
5
Packaging
T
Product classification code
Type
CM
BU
Shape
RC
MC
01 ～ 10
Taped products
Common mode choke coils
Surface mount type
2
6
Dimensions of Corefmmg
Internal code
Q
Standard Products
04
3.5
05
5.0
QWBlank space
ꢀꢀ
392
外形寸法ꢀEXTERNAL DIMENSIONS
BU05MC h2 Linesi type
BU05MC h3 Linesi type
f0.5g
f0.020g
f0.5g
f0.020g
f0.5g
1.5M0.2
f0.059M0.008g
f0.020g
f0.5g
3.0M0.2
f0.020g
f0.118M0.008g
5.0M0.3
f0.197M0.012g
5.0M0.3
f0.196M0.012g
5
CM04RC h2 Linesi type
CM04RC h3 Linesi type
CM04RC h3 Linesi type fThing
CM04RC h4 Linesi type
f0.5g
f1.3g
f0.05g
f1.3g
f0.051g
f0.020g
f1.3g
f0.051g
f0.5g
2.54M0.25
f0.100M0.010g
1.27M0.25
f0.6g
2.54M0.25
f0.5g
f0.020g
f0.024g
f0.050M0.010g
f0.5g
2.54M0.25
f0.020g
f0.100M0.010g
f0.020g
5.2M0.2
f0.205M0.008g
5.3M0.2
f0.208M0.008g
f0.100M0.010g
7.4M0.2
f0.291M0.008g
9.8M0.2
f0.354M0.008g
公差のない数値 は参考値 です。 The values without tolerance are for reference only.
推奨ランドパターンꢀRecommended Land Patterns
UnitDmmfinchg
【CM04RC】�
1.6
6.7
1.6
1.2 0.7 1.2
UnitDmm
アイテム一覧ꢀPART NUMBERS
CM04RCタイプ
EHS
インピーダンス
Impedance
[E]
直
流抵抗
定格電流
定格電圧
絶縁抵抗
形名
ライン数
(Environmental
Hazardous
DC resistance
Rated current
Rated voltage Insulation resistance
[E]
[A]
fmax.g
[V]
fD.C.g
[ME]
fmin.g
Ordering code
No. of Lines
Substances)
ftypicalg
fmax.g
CM04RC01T
CM04RC07T
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
800 fat 100MHzg
500 fat 160MHzg
270 fat 200MHzg
100 fat 200MHzg
1000 fat 100MHzg
1000 fat 200MHzg
800 fat 100MHzg
0.06
0.06
0.03
0.02
0.18
0.2
1.5
2.5
3.0
4.0
0.5
0.5
0.5
2
CM04RC09T
CM04RC10T
50
100
CM04RC02T
3
4
CM04RC08TfTHINg
CM04RC05T
0.2
BU05MCタイプ
EHS
インピーダンス
Impedance
[E]
直
定格電圧 絶縁抵抗
流抵抗
DC resistance
[E]
定格電流
Rated current
[A]
形名
ライン数
No. of Lines
(Environmental
Hazardous
Rated voltage Insulation resistance
[V]
[ME]
fmin.g
Ordering code
Substances)
ftypicalg
fmax.g
fmax.g
fD.C.g
BU05MC01T
BU05MC08T
RoHS
RoHS
2
3
1000 (at 60MHz)
700 (at 60MHz)
0.12
0.11
1
50
100
0.5
セレクションガイド
Selection Guide
アイテム一覧
Part Numbers
特性図
Electrical Characteristics
梱包
Packaging
信
頼性
使用上の注意
Reliability Data
Precautions
P.12
etc
P.393
P.394
P.395
P.412
P.416
393
特性図ꢀELECTRICAL CHARACTERISTICS
インピーダンス周 波数特性例ꢀImpedance -vs- Frequency characteristicsfMeasured by HP4291Ag
コモンモード
Common mode
ノーマルモード
Normal mode
394
梱包ꢀPACKAGING
1最小受注単位数 Minimum Quantity
4リール寸法ꢀReel size
fpcs.g
最小受注単位数
Minimum Quantity
Type
ꢀテーピング
Taping
1500
CM04RC [2 Lines] type
CM04RC [3 Lines] type
CM04RC [3 Lines] type (Thin)
CM04RC [4 Lines] type
BU05MC [2 Lines] type
BU05MC [3 Lines] type
1000
2500
1000
5
2500
2500
2テーピング材質 Tape Material
Type
A
B
C
B100M1
fB3.94M0.039g
B80M1
B330M2
18M1.5
CM04RC
fB12.99M0.079g
B330M2
f0.709M0.059g
13.5M1
BU05MC
fB3.15M0.039g
fB12.99M0.079g
f0.53M0.039g
UnitDmmfinchg
3リーダー部Y空部 Leader and Blank Portionꢀ
空部
（リーダー部側
空部
（チップ挿入部側
リーダー部
）
）
Type
Leader
Blank portions
(Leader side)
Blank portions
(Chip cavity side)
CM04RC
BU05MC
150(5.89)
150(5.89)
80(3.14)
80(3.14)
80(3.14)
80(3.14)
UnitDmmfinchg
395
梱包ꢀPACKAGING
挿入ピッチ
Insertion
pitch
チップ挿入部
Chip cavity
テープ厚 み
Tape thickness
ꢀエンボステープ fCM04RCタイプgꢀEmbossed tape fCM04RC typeg
f1g 8mm pitch (0.31 inches pitch)
ライン数
Lines
Type
A
B
K
T
2
3
8.0M0.1 5.7M0.1 9.65M0.1 5.2max 0.4M0.05
12.0M0.1 9.8M0.1 7.7M0.1 5.0max 0.38M0.05
CM04RC
BU05MC
3 (THIN) 8.0M0.1 5.7M0.1 9.8M0.1 3.1max 0.4M0.05
4
2
3
12.0M0.1 10.3M0.1 10.3M0.1 5.0max 0.3M0.05
8.0M0.1 5.35M1.5 5.7M0.2 3.2M0.1 0.4M0.05
UnitDmm
f2g 12mm pitch (0.472 inches pitch)
6トップテープ強度ꢀTop Tape Strength
トップテープのはがし力は、下図矢印方向にて0.1V0.7Nとなります。
The top tape requires a peel-off force of 0.1 to 0.7N in the direction of the
arrow as illutrated below.
ꢀエンボステープ fBU05MCタイプgꢀEmbossed tape fBU05MC typeg
UnitDmmfinchg
396
RELIABILITY DATAꢀ
1/2
Specifled Value
Item
Test Method and Remarks
CommonMode Choke Coils
CM04RC
CommonMode Choke Coils
BU05MC
1.Operating Temperature
Range
K25CVJ120C
Including self-generated heat
2.Storage Temperature
Range
K40CVJ85C
K5 to J40C in taped packaging
Within the specified tolerance
Within the specified tolerance
The maximum DC value having temperature increase within speci-
fied temperature,as detailed in individual specification.
Measuring equipmentDHP 4291A or its equivalent
Measuring frequencyDSpecified frequency
3.Rated current
5
4.Impedance
5. Inductance
Within the specified tolerance
Within the specified tolerance
SMD transformer・Commom mode choke coilD
6.DC Resisitance
Measuring equipment
D
DC ohmmeter
Refer to individual specification.
Accoding to JIS C0051
7.Resisitance to flexure of
substrare
CM04RCYBU05MC
3mm
Warp
Pressing speed
Duration
0.5mm/sec.
5M1sec.
Pressig jig
Board
8.Insulation resistanceD
between wires
100ME min.
Applied voltageDRated voltage
DurationD60 sec.
9.Rated current
Within the specification
No abnormality
Applied voltageDRegulation voltage
DurationD60 sec.
10.Withstanding voltageD
between wires
Refer to individual specification.
Accoding to JIS C0040
11.Resisitance to vibration
DirectionsD2 hrs each in X
Frequency range 10 to 55 to 10 Hz
AmplitudeD1.5mm fShall not exceed acceleration 196m/s2g
Mounting method soldering onto printed board
,
Y,
and Z directions. TotalD6 hrs
D
f1 min.
g
D
RecoveryDAt least 2 hrs of recovery under the standard
condition after the test,followed by the mea-
surement within 24 hrs.
A kind of vibrationDA
12.Solderability
At least 75L of terminal electrode is covered by new
solder.
CM04RCYBU05MC
Solder temperature
Duration
235M5C
2M0.5 sec.
Immersion depth
Up to 0.5mm from terminal root
13.Resisitance to soldering
heat
Refer to individual specification.
① Reflow soldering
PreheatingD100 to 150C 1 to 2min.
PeakD230 to 240C Within 5sec.
More than 200C Within 40 sec.
Number of reflowDWithin 2 times.
② Manual soldering
Solder temperatureD350M5C
DurationD3M1sec.
RecoveryD1 to 2 hrs of recovery under the standard
condition after the test.
413
RELIABILITY DATAꢀ
2/2
Specifled Value
Item
Test Method and Remarks
CommonMode Choke Coils
CM04RC
CommonMode Choke Coils
BU05MC
14.Thermal shock
Refer to individual specification.
Accoding to JIS C0025
Conditions of 1 cycle
TemperaturefCg
Durationfming
CM04RCYBU05MC
K25M3C
1
2
3
4
30M3
3
Room temperature
85M3C
5
30M3
3
Room temperature
Number of cycyleD10 cycles
RecoveryD1V2 hrs of recovery under the standard condi-
tion after removal from test chamber.
Refer to individual specification.
15.Loading under damp heat
CM04RCYBU05MC
Temperature
Humidity
40M3C
90V95L
Applied current
Duration
Rated current
1000M24
RecoveryD1V2 hrs of recovery under the standard condi-
tion after removal from test chamber.
16.High temperature life test Refer to individual specification.
CM04RCYBU05MC
Temperature
Duration
85M3C
1000M24
RecoveryD1V2 hrs of recovery under the standard condi-
tion after removal from test chamber.
17.Low Temperature life Test Refer to individual specification.
CM04RCYBU05MC
Temperature
Duration
K40M3C
1000M24
RecoveryD1V2 hrs of recovery under the standard condi-
tion after removal from test chamber.
Note on standard condition: "standard condition"
referred to herein is defined as follows:
5 to 35C of temperature, 45 to 85% relative humidity and 86 to 106kPa of air pressure.
When there are questions conceming measurement results:
In order to provide correlation data, the test shall be conducted under condition of 20M2C of tempera-
ture, 45 to 85% relative humidity and 86 to 106kPa of air pressure.
Unless otherwise specified, all the tests are conducted under the "standard condition."
415
PRECAUTIONS
CM04RC，BU05MC
Stages
Precautions
Technical considerations
1.Circuit Design
Operating environment,
1.The products described in this specification are intended for
use in general electronic equipment,(office supply
equipment, telecommunications systems, measuring
equipment, and household equipment). They are not
intended for use in mission-critical equipment or systems
requiring special quality and high reliability (traffic systems,
safety equipment, aerospace systems, nuclear control
systems and medical equipment including life-support
systems,) where product failure might result in loss of life,
injury or damage. For such uses, contact TAIYO YUDEN
Sales Department in advance.
5
2.PCB Design
Land pattern design
Surface Mounting�
1.Please contact any of our offices for a land pattern, and refer
to a recommended land pattern of specifications.
YMounting and soldering conditions should be checked beforehand.�
YApplicable soldering process to this products is reflow soldering only.�
YRecommended Land Patterns
【CM04RC】�
【BU05MC】�
0.5 0.5
1.6
6.7
1.4
3.2
1.4
1.6
1
1
1
1.8 0.74 1.8
UnitDmm
UnitDmm
3.Considerations for
automatic placement
Adjustment of mounting machine
1.Excessive impact load should not be imposed on the
products when mounting onto the PC boards.
2.Mounting and soldering conditions should be checked
beforehand.
1. When installing products, care should be taken not to apply distortion stress as it may
deform the products.
4.Soldering
Reflow soldering
1.Please contact any of our offices for a reflow soldering, and
refer to the recommended condition specified.
2.This products is reflow soldering only.
3.SMD Inductors
1.If products are used beyond the range of the recommended conditions, heat stresses
may deform the products, and consequently degrade the reliability of the products.
Please do not add any stress to a product until it returns in
normal temperature after reflow soldering.
Lead free soldering
1.When using products with lead free soldering, we request to
use them after confirming of adhesion, temperature of
resistance to soldering heat, soldering etc sufficiently.
Recommended conditions for using a soldering iron:
Put the soldering iron on the land-pattern.
Soldering iron's temperature - Below 350 ℃
Duration - 3 seconds or less
The soldering iron should not directly touch the inductor.
Cleaning conditions
5.Cleaning
6.Handling
1.SMD Inductors
Please contact any of our offices for a cleaning,
Handling
1.Keep the product away from all magnets and magnetic
objects.
1.There is a case that a characteristic varies with magnetic influence.
Breakaway PC boards (splitting along perforations)
1.When splitting the PC board after mounting product, care
should be taken not to give any stresses of deflection or
twisting to the board.
1.Planning pattern configurations and the position of products should be carefully
performed to minimize stress.
2.Board separation should not be done manually, but by using
the appropriate devices.
Mechanical considerations
1.Please do not give the product any excessive mechanical
shocks.
1.There is a case to be damaged by a mechanical shock.
2.SMD Inductors
2.SMD Inductors
Please do not add any shock and power to
transportation.
a
product in
There is a case to be broken by the handling in transportation.
Pick-up pressure
1.SMD Inductors
1.SMD Inductors
Please do not push to add any pressure to a winding part.
Damage and a characteristic can vary with an excessive shock or stress.
Please do not give any shock and push into a ferrite core
exposure part.
Packing
1.SMD Inductors
Please avoid accumulation of
a
packing box as much as
1.There is
a case that transformation and a product of tape are damaged by
possible.
Storage
accumulation of a packing box.
7.Storage conditions
1.To maintain the solderability of terminal electrodes and to
keep the packing material in good condition, temperature
and humidity in the storage area should be controlled..
・Recommended conditions
1.Under a high temperature and humidity environment, problems such as reduced
solderability caused by oxidation of terminal electrodes and deterioration
of taping/packaging materials may take place.
ꢀAmbient temperatureꢀꢀꢀꢀꢀ 0～40℃
ꢀHumidity
ꢀBelow 70% RH
The ambient temperature must be kept below 30℃. Even
under ideal storage conditions, solderability of products
electrodes may decrease as time passes. For this reason,
product should be used within one year from the time of
delivery.�
�
In case of storage over
6 months, solderability shall be
checked before actual usage.
417
相关型号：
©2020 ICPDF网 联系我们和版权申明